Junyao will hold a pre-IPO performance conference on November 10 and is expected to be listed for trading in early December. Chairman Lin Zeqi said that he is optimistic that the wave of new machine replacements will help drive demand for after-sales ICs. Currently, bridge ICs are still the main source of shipments, but driver ICs will gradually increase in volume, and shipments of TDDI (touch panel sensor chips) will be launched in the second quarter of next year.

Lin Zeqi said that Junyao is mainly engaged in the design and development of high-speed transmission interface, image signal processing and high-sensitivity touch IC related products. The main function of the product is to transmit signals between the display module and the mobile phone motherboard, as well as process the user's touch input signal, and translate the touch actions into corresponding operating instructions. It is mainly used in the second-hand mobile phone and after-sales repair market.

Lin Zeqi pointed out that Junyao can provide customized, highly compatible bridge IC products for diverse screen specifications and establish a clear competitive advantage in the second-hand mobile phone after-sales market. The touch IC products provided are used in low-end smartphones and have entered the game controller field of international game manufacturers, gradually expanding the application of the product end market.

Lin Zeqi shared that with the rapid increase in demand for high refresh rate display, high-resolution image processing and low-latency transmission in the mid- to high-end smartphone market, the after-sales repair market has seen a large demand for high-performance display chips. Junyao continues to develop into mid-to-high-end products to ensure continued profits and innovative research and development, and actively deploys new TDDI products. It has also completed three key chips for the after-sales screen market in the mobile phone screen market.

Lin Bingqi, general manager of Junyao Technology, said that Junyao entered the mobile phone touch after-sales market in 2018, and currently more than 80% of its revenue comes from bridge ICs. It is currently estimated that the mobile phone after-sales market will have a demand of 400 million units by 2026, of which about 60 million mobile phone repairs will require the use of bridge ICs.

Lin Bingqi pointed out that Junyao has been working in bridge IC for more than 10 years, and currently has more than 10 product lines, providing diversified solutions and realizing one-stop service for mobile phones. Since the market size of after-sales chip TDDI is 10 times that of bridge IC, Junyao has invested in after-sales screen TDDI in 2024. R&D is expected to increase in volume in the second quarter of next year and is expected to become Junyao’s next growth driver.

Lin Bingqi emphasized that Junyao has been deeply involved in the mobile phone after-sales market for many years, accumulated a complete product line and customer service experience, can quickly respond to the needs of diversified models, and has achieved long-term cooperative relationships with product stability and quality. As Junyao continues to strengthen R&D energy and expand cooperation with strategic partners, it is expected to increase penetration in the mid-to-high-end mobile phone market, driving the overall operating outlook to continue to be promising.

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