Market news has been reported that Changjiang Cash (YMTC) is preparing to enter the DRAM manufacturing field and plans to cooperate with Changxin Cash (CXMT) to lock in the high-frequency wide memory (HBM) market, which is in line with the Chinese government's desire to reduce its dependence on Samsung, SK Hynix and Micron.

In the regulations of last December, the US Bureau of Industry and Safety (BIS) specially included HBM in the regulatory list, while expanding restrictions on chip manufacturing equipment and reinforcing China's opportunity to obtain these key technologies.

In terms of technological progress, Changxin Cunjian has previously completed the development of HBM2, accelerated the production of HBM3, and started large-scale investment facilities in 2024. Many Chinese media and research units expect that their HBM3 and HBM3E will be produced in mass between 2026 and 2027. Analysts believe that although Changxin’s deposit has fallen into Korean business for several years, it has shown a faster track of tracking.

Foreign media Tom’s Hardware pointed out that in this potential cooperation, Changjiang Cunyuan’s value lies not in DRAM experience, but in bonding technology. According to Chinese media reports in the past, Changjiang Cunchuang uses "Xtacking" technology to apply it to 3D NAND, which can effectively improve data processing speed.

As the HBM stacking height increases, the whole body is moving towards the Hybrid Bonding technology to improve frequency width and heat dissipation efficiency. At the same time, China is also building an HBM packaging supply chain. According to Reuters, Changxin Cunjian and Wuhan Xinxin are developing HBM packaging technology, and Tongfu Microelectronics has also entered the packaging field.

The United States continues to tighten the control of China's crystalline factories, and Taiwan Power's Nanjing factory has also lost its qualification for rapid approval, which once again highlights the increasing strict export access and long processes. At present, whether the cooperation between Changjiang Cunjia and Changxin Cunjia can be successfully implemented depends on the progress of equipment and customer verification.

YMTC and CXMT team up to accelerate Chinese domestic HBM production — partnership brings hybrid bonding and DRAM expertise together

Extended reading: Discussing about the supplement of American chips, the material: only the effect on the side is effective, and the actual impact is limited Samsung, SK Hynix Chinese manufacturers are having trouble gaining US technology, investment bank: may impact global memory supply